智能终端产品
常规刚性产品
汽车产品
射频与微波材料
金属基板与高导热产品
IC封装产品
软性材料产品
高速产品
特种产品
- HDI
- HDI
- Smart Terminal
- IC Substrate
- Thermosetting Resin Type
- Hydrocarbon Laminate
- PTFE Type
- Thermal Conductive CEM-3
- Thermal Conductive CEM-1
- Other
- Thermal Conductive FR-4.0
- Copper Base CCL
- Al Base CCL
- Ultra-low Loss Material
- Very Low-loss Material
- Low-loss Material
- Mid-loss Material
- Automotive materials
- CEM-1
- CEM-3, CEM-3.1
- Halogen Free and Lead Free Compatible FR-4.1, FR-15.1
- Lead Free Compatible FR-4.0, FR-15.0
- Conventional FR-4
- Flexible copper clad laminate
- Coverlay
- No-flow prepreg
- Stiffener
- Bonding film
- PET laminated busbar
- Rigid Polyimide Material
- Semi-flex Material
- Special Bonding Prepreg
- RCC
- Rigid Materials
- RF Materials
- Automotive Materials
- Flexible Materials
- IC Substrate Materials
- IMS and HTC materials
- Special Materials
- HSD Materials
- 不流动P片
- 其它
- 超低介质损耗
- 低介质损耗
- 叠层母排用绝缘胶膜
- CEM-1
- CEM-3, CEM-3.1
- PTFE Type
- 热固性树脂体系
- 硬质聚酰亚胺材料
- 半挠性材料
- 特种粘合材料
- 中等介质损耗
- 铝基板
- 铜基板
- 挠性覆铜板
- 覆盖膜
- 胶膜
- 补强板
- 常规FR-4.0
- 无铅兼容FR-4.0, FR-15.0
- 无卤无铅兼容FR-4.1, FR-15.1
- IC Substrate
- 涂树脂铜箔
- 碳氢系列产品
- 导热FR-4.0
- 汽车产品
- 智能终端产品
- 常规刚性产品
- 汽车产品
- 射频与微波材料
- 金属基板与高导热产品
- IC封装产品
- 软性材料产品
- 高速产品
- 特种产品
- 2018
- 2017
- 2016
- 2015
- 2014
- 2013
- 2011
- 2010
- 2007
- 2006
- 2004
- 2002
- 2000
- 1999
- 1998
- 1994
- 1990
- 1985
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009